1.1 ,The specification covers a two-part modified epoxy paste adhesive for bonding metallic and nonmetallic materials. The adhesive should be suitable for forming bonds that can withstand environmental exposure to temperatures from –,184 to 82 °,C [–,300 to 180 °,F] when exposed to an expected combination of stress, temperature, and relative humidity to be encountered in service.
Note 1: ,When coordinated through the Department of Defense (DoD) and the National Aeronautics and Space Administration (NASA), this practice will be a direct replacement of MIL-A-82720 (OS), MIS-26872, and MSFC-SPEC-2037.